design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. thick film chip resistors e 1 r 2 j 3 3 4 g 5 e 6 y 7 j 8 1 9 0 10 2 11 v 12 thick film chip resistors product code size, power rating 1ge : 0201 2ge : 0402 3ge : 0603 6ge : 0805 8ge : 1206 14 : 1210 12 : 1812 12z : 2010 1t : 2512 0.05 w 0.063 w 0.1 w 0.125 w 0.25 w 0.25 w 0.5 w 0.5 w 1w power r. marking code y ] nil marking value marking on black side no marking resistance tolerance code j 0 tolerance 5% jumper the first two digits are significant figures of resistance and the third one denotes number of zeros following. decimal point is expressed by r as 4.7 = 4r7. jumper is expressed by r00. resistance value packaging methods code c x v u b packaging
pressed carrier taping 2 mm pitch, 15000 pcs. (only 1ge type) punched carrier taping 2 mm pitch, 10000 pcs. (only 2ge type) punched carrier taping (only 3ge, 6ge, 8ge type) embossed carriertaping (only 14, 12, 12z, 1t type) bulk case (only 2ge, 3ge type) type : inches thick film chip resistors 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 type: erj 1g, 2g, 3g, 6g, 8g, 14, 12, 12z, 1t n features l small size and lightweight for pcb size reduction and lightweight products l high reliability metal glaze thick film resistive element and three layers of electrodes result in high reliability l matching with placement machine taping and bulk case packagings for automatic placement machine l solderability suitable for both reflow soldering and flow soldering l reference standards iec 60115-8, jis c 5201-8, eiaj rc-2134b n explanation of part numbers l erj1ge, 2ge, 3ge, 6ge, 8ge, 14, 12, 12z, 1t series, 5 % type ] when omitted, all the rest p/n factors shall be moved up respectively. (only 1ge, 2ge type and bulk case)
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. thick film chip resistors erj1g 0.60 0.03 0.30 0.03 0.10 0.05 0.15 0.05 0.23 0.03 0.15 (0201) erj2g 1.00 0.05 0.50 0.05 0.20 0.10 0.25 0.05 0.35 0.05 0.8 (0402) erj3g 1.60 0.15 0.80 +0.15 0.30 0.20 0.30 0.15 0.45 0.10 2 (0603) e erj6g (0805) 2.00 0.20 1.25 0.10 0.40 0.20 0.40 0.20 0.60 0.10 4 erj8g 3.20 +0.05 1.60 +0.05 0.50 0.20 0.50 0.20 0.60 0.10 10 (1206) erj14 3.20 0.20 2.50 0.20 0.50 0.20 0.50 0.20 0.60 0.10 16 (1210) erj12 4.50 0.20 3.20 0.20 0.50 0.20 0.50 0.20 0.60 0.10 27 (1812) erj12z 5.00 0.20 2.50 0.20 0.60 0.20 0.60 0.20 0.60 0.10 27 (2010) erj1t 6.40 0.20 3.20 0.20 0.65 0.20 0.60 0.20 0.60 0.10 45 (2512) (1) rated continuous working voltage (rcwv) shall be determined from rcwv= power rating resistance values, or limiting element voltage (max. rcwv) listed above, whichever less. (2) overload (short-time overload) test voltage (sotv) shall be determined from sotv=2.5 power rating or max. overload voltage listed above whichever less. n construction n dimensions in mm (not to scale) n ratings a b t w l ? dimensions (mm) lwa b t mass (weight) [g/1000 pcs.] type (inches) e0.20 e0.15 protective coating alumina substrate electrode (inner) electrode (between) thick film resistive element electrode (outer) power derating curve for resistors operated in ambient temperatures above 70 ?c, power rating shall be derated in accordance with the following figure. e40 e20 0 20 40 60 80 100 120 140 160 0 180 e60 155 ?c 70 ?c ambient temperature (?c) 20 40 60 80 100 rated load (%) e55 ?c 3g, 6g, 8g 1g,2g,14,12,12z,1t 125 ?c erj1g (0201) erj2g (0402) erj3g (0603) erj6g (0805) erj8g (1206) erj14 (1210) erj12 (1812) erj12z (2010) erj1t (2512) < 10 w: e100 to +600 0.05 0.063 0.1 0.125 0.25 0.25 0.5 0.5 1 15 50 50 150 200 200 200 200 200 30 100 100 200 400 400 400 400 400 5 5 5 5 5 5 5 5 5 10 w to 1 m w: 200 1m w<: e400 to +150 1 to 10 m (e24) 1 to 10 m (e24) 1 to 10 m (e24) 1 to 10 m (e24) 1 to 10 m (e24) 1 to 10 m (e24) 1 to 10 m (e24) 1 to 10 m (e24) 1 to 1 m (e24) - 55 to +125 - 55 to +125 - 55 to +155 - 55 to +155 - 55 to +155 - 55 to +125 - 55 to +125 - 55 to +125 - 55 to +125 type (inches) power rating at 70 ?c (w) limiting element voltage (maximum rcwv) (1) (v) maximum overload voltage (2) (v) resistance tolerance (%) category temperature range (operating temperature range) ( ?c ) resistance range ( w ) t.c.r. [ 10 -6 /?c (ppm/?c)] 0.5 1 12 24 maximum overload current (a) rated current (a) type (inches) e0.05 erj1g (0201) erj2g (0402) erj3g (0603) erj6g (0805) erj8g (1206) erj14 (1210) erj12 (1812) erj12z (2010) erj1t (2512)
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. thick film chip resistors n packaging methods (taping) l standard quantity l bulk case f b w t f a f c slider shutter 110 38 12 erj1g pressed carrier taping 15000 pcs./reel erj2g 2 mm 10000 pcs./reel erj3g erj6g punched carrier taping erj8g 5000 pcs./reel erj14 4 mm erj12 erj12z embossed carrier taping erj1t 4000 pcs./reel type kind of taping pitch (p 1 ) quantity type a b w f e p 1 p 2 p 0 f d 0 t f d 1 erj1g 0.38 0.05 0.68 0.05 2.00 0.10 0.42 0.05 _ erj2g 0.70 0.05 1.20 0.05 0.52 0.05 _ erj3g 1.10 0.10 1.90 0.10 8.00 0.20 3.50 0.05 0.70 0.05 _ erj6g 1.65 0.15 2.50 0.20 0.84 0.05 _ erj8g 2.00 0.15 3.60 0.20 1.75 0.10 2.00 0.05 4.00 0.10 1.50 +0.10 _ erj14 2.80 0.20 3.50 0.20 8.00 0.30 4.00 0.10 1.0 +0.10 erj12 3.50 0.20 4.80 0.20 1.00 0.10 erj12z 2.80 0.20 5.30 0.20 12.00 0.30 5.50 0.20 1.5 min. erj1t 3.60 0.20 6.90 0.20 - 0 type f a f b f cw t erj1g erj2g erj3g erj6g 9.0 1.0 11.4 1.0 erj8g 180.0 +0 60 min. 13.0 1.0 erj14 erj12 erj12z 13.0 1.0 15.4 2.0 erj1t - 3.0 (unit : mm) (unit : mm) tt t a p 0 p 2 p 1 p 1 f d 0 f d 1 (only emboss) b f w e (2 mm pitch) l taping reel l carrier tape (unit : mm) n packaging methods (bulk case) l standard quantity type quantity erj2g 50000 pcs. / case erj3g 25000 pcs. / case pressed carrier punched carrier embossed carrier - 0
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or us e. should a safety concern arise regarding this product, please be sure to contact us immediately. thick film chip resistors erj1g(0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 erj2g(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 erj3g(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 erj6g(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 erj8g(1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 erj14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 erj12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 erj12z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 erj1t(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5 n recommended land pattern in the case of flow soldering, the land width must be smaller than the chip resistor width to control the solder amount properly. generally, the land width should be 0.7 to 0.8 times (w) of the width of chip resistor. in the case of reflow solderi ng, solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (w). chip resistor c a b type (inches) dimensions (mm) abc cautions for safety n recommended soldering conditions recommendations and precautions are described below. preheating peak heating temperature time l recommended soldering conditions for reflow reflow soldering shall be two times maximum. please contact us for additional information when you use in conditions other than those specified. please measure a temperature of terminations and study solderability every kind of solder and board, before actual use. temperature time preheating 140 ?c to 160 ?c 60 s to 120 s main heating above 200 ?c 30 s to 40 s peak 235 5 ?c max. 10 s temperature time preheating 150 ?c to 180 ?c 60 s to 120 s main heating above 230 ?c 30 s to 40 s peak max. 260 ?c max. 10 s for solder (example : sn/pb) for lead-free solder (example : sn/ag/cu) l recommended soldering conditions for flow for solder for lead-free solder temperature time temperature time preheating 140 ?c to 160 ?c 60 s to 120 s 150 ?c to 180 ?c 60 s to 120 s soldering 2455 ?c 20 s to 30 s max. 260 ?c max. 10 s the following are precautions for individual products. please also refer to the precautions common to fixed resistors shown on page er3 of this catalog. 1. take measures against mechanical stress during and after mounting of thick film chip resistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. 2. if a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. never exceed the rated power. otherwise, the performance and/or reliability of the resistors may be impaired. 3. do not use halogen-based or other high-activity flux. otherwise, the residue may impair the resistors' performance and/or reliability. 4. when soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. when using a soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 ?c max.). 5. as the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amount of solder. 6. do not apply a shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 7. avoid excessive bend of printed circuit boards in order to protect the resistors from abnormal stress.
C er3 C caution for safety (common precautions for fixed resistors) when using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. the design and specifications in this catalog are subject to change without prior notice. do not use the products beyond the specifications described in this catalog. this catalog explains the quality and performance of the products as individual components. before use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ] systems equipped with a protection circuit and a protection device ] systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) precautions for use these products are designed and manufactured for general purpose and standard use in general electronic equip ment (e.g. av equipment, home electric appliances, office equipment, information and communication equipment) these products are not intended for use in the following special conditions. before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. in an environment where strong static electricity or electromagnetic waves exist 5. in an environment where these products cause dew condensation 6. sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials these products generate joule heat when energized. carefully position these products so that their heat will not affect the other components. carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the perfor mance or reliability of the products. carefully select a flux cleaning agent for use after soldering. an unsuitable agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 ?c to 35 ?c and a relative humidity of 45 % to 85 %. even within the above guarantee periods, do not store these products in the following conditions. otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package markings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english.
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